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    Our Company

    ESCATEC have a long history of providing design and manufacturing solutions to world-renowned OEMs. We realise their ideas, from concept to delivery to after-sales service, and offer them the specific solutions they need.

    Who we are
    Market Segments

    ESCATEC partners with numerous major OEM brands across a wide range of market segments. We have helped OEMs in a variety of sectors such as; Industrial Electronics; Medical, Healthcare & Life-sciences; Mobility & Transportation; IoT & Connected Devices.

    Who we serve
    Global Facilities

    ESCATEC has a global footprint with production facilities in the UK, the Czech Republic, Switzerland, Bulgaria, and Malaysia. We have the capacity, expertise, and sector experience to better serve customers across a broader range of industries.

    Where we are
    Innovate

    You are an inventor. You have the idea, the concept, the vision of what you want to create. So, together, we Innovate. Through our design and development and NPI processes, we take your idea and make it a reality by turning it into a marketing leading product.

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    Scale

    Whatever product or market, ESCATEC is a truly global company with sites across Europe and Asia that use the latest technology. We seamlessly transition from prototyping to volume manufacturing so you can Scale and meet the needs of your market.

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    Repeat

    Demand for your product is strong but you know it’s only a matter of time before the competition start to try and catch up. You’re not looking to standstill, you’re a market leader, and that’s where the ‘Repeat’ stage of the ESCATEC process kicks in.

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    CASE STUDY
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    Module package for Broadcom 3D-TOF sensors

    Broadcom Inc. is a global technology leader that designs, develops, and supplies a broad range of semiconductor, enterprise software, and security solutions.

     

    Broadcom’s category-leading product portfolio serves critical markets including cloud, data center, networking, broadband, wireless, storage, industrial, and enterprise software.

     

    IFPD, one of Broadcom’s 26 divisions, is leveraging on their deep know-how in electrooptical IC-design and expanding their product portfolio towards optical sensing with the 3D-TOF distance sensor being an integral part of it.

     

    Broadcom - Industrial and other applications of ToF sensor

     
    The Challenge

    IFPD was looking to bring its powerful TOF-ASIC into an adequate package and release a high-end 3D ToF-sensor to the market. This new addition to their product portfolio would help their customers power drones, robotics, and factory automation applications in a range of demanding settings.

    Due to the high requirements for the optical performance of the device IFPD asked for specialist support to collaborate on an optical package for their cutting-edge lens and ASIC technology.

    Broadcom 3D ToF sensor

     

    The Solution

    Broadcom collaborated with ESCATEC, leveraging their expertise in packaging, Chip-on-Board (CoB) processes, and advanced optical engineering to develop a compact and efficient 3D Time-of-Flight (ToF) sensor module.

    The ESCATEC team supported Broadcom in achieving their ambitious target to develop a miniaturised package design for the cutting-edge 3D-ToF sensor, utilising standard PCB technology and iterate their innovative design against tight time scales, as they raced to complete in a rapidly evolving sensor market.

    The Results

    The project moved from initial contact to mass production in just over 2 years highlighting ESCATEC's efficiency in process development and prototype validation.

    ESCATEC’s DfM and Value Engineering support helped define the NPI requirements for when the design was handed over to Broadcom’s manufacturing team.

     

    The support extended beyond initial development, providing troubleshooting and technical transfer assistance to the manufacturing site. Eventually, the sensor has become the benchmark in range-performance in challenging conditions on the market.

     

    The successful collaboration on the 3D-ToF sensor laid the foundation for an ongoing partnership, with Broadcom returning to ESCATEC for new projects and complex product developments.

    It’s been an exciting journey together with the very skilled and professional team from ESCATEC. We’ve learned a lot during our project.

    Stefan Brunner, Business Development Manager SiPM & ToF Sensors