In today's tech-driven world, microelectronics plays a pivotal role in powering innovation across various industries. With 40 years of experience in the electronics manufacturing industry, we have honed our skills and capabilities to deliver flawless microelectronics assembly solutions.
From the devices we use daily through to advanced medical equipment and industrial technology, microelectronics are the unsung heroes behind the scenes. At ESCATEC, we recognise the critical importance of microelectronics assembly and have established ourselves as industry leaders in this field.
Our experienced micro-assembly team have designed, developed, and manufactured a wide range of innovative devices including security camera modules, Time of Flight sensors, LiDAR systems, tire pressure sensors, micro scanners, NIR spectrometers, high-performance LED, laser, and lighting solutions.
With state-of-the-art cleanroom facilities, advanced technology and equipment, our team of highly skilled professionals, based in Switzerland, ensures that every assembly project meets the highest standards of quality, precision, and reliability.
At ESCATEC, we offer a comprehensive suite of microelectronics assembly services, including:
Many factors must be considered when designing an optimised and fully functioning Micro-Opto-Electronic-Mechanical-System (MOEMS) device. One of the most important factors for robust functionality is a stable production process. Our demonstrable experience spanning decades allows us to offer customers a range of development services around MOEMS technologies resulting in more compact, efficient, higher performing and cost-effective devices.
Our Chip On Board (COB) process steps consist of die bonding, wire bonding and several encapsulation techniques including glob top, dam (or underfill) and optical clear encapsulation.
The range of die bonding machines we have can work to +/- 1um, stamping or dispensing adhesives, and picking and placing bare chips from blue tape, waffle packs or gel packs.
Our wire bonding machines are suitable for all wirebond technologies including gold ball and thin wire. Quick and simple bond head changeover times of under 30 minutes can be achieved along with continuing monitoring and control of the bond process.
By partnering with ESCATEC, you gain access to numerous advantages:
Our Technology Council ensure we stay ahead of the curve through continuous research and development. Our commitment to innovation enables us to leverage the latest technologies and methodologies to enhance our microelectronics assembly services.
With a global presence and strategically located facilities, we can serve clients around the world. No matter where you are, ESCATEC is ready to meet your microelectronics assembly needs.
We proudly serve a diverse range of industries, including:
ESCATEC's manufacturing capabilities are complemented by enhanced support services for our clients, such as design and development support, test solutions, sophisticated supply chain management, postponement manufacturing and direct-ship outbound logistics.
We support customers from the prototype and industrialisation stages, through to the ongoing manufacture of complex, multi-technology PCBAs, in low, medium and high volumes.
We're experts in complex sub-assemblies and finished, tested, products. We offer turnkey electronics, mechatronics, cabinet assembly, system integration & test solutions.
ESCATEC offers a wide range of mechatronics solutions and supply chain experience - everything from ‘benchtop’ products through to ‘large format’ electro-mechanical machines.
From simple CNC turned components to elaborate CNC milled assemblies, we cater to diverse sectors, including industrial electronic, transportation and medical device manufacturing.
A proven method of electronics manufacturing defect detection and prevention, flying probe testing also eliminates the requirement for dedicated fixturing.
At ESCATEC we use cutting-edge technology and equipment, to ensure that every injection moulding project we undertake meets the highest standards of quality and precision.
Our experienced teams design, develop and manufacture high performance LED, laser, and lighting solutions. We ensure micro-optic needs for complex MOEMS products are met and delivered.
We specialise in electronics, software, mechanical, and system design and development. Following Design for eXcellence (DfX), Design for Manufacture (DFM), and VA/VE best practices, we turn your ideas into market-ready products.
Our unmatched NPI support is characterised by lean project management, comprehensive testing, robust supply chain management, and close collaboration with your teams to minimise risks, maximise results, and ensure product quality.
With our established global supplier partnerships, our experienced procurement, SCM, and logistics teams can identify the best sourcing options based on your needs. We supply a vast range of products to various sectors reliably and cost-effectively.
With our prototyping services, we are with you every step of the way, from schematic design to functional testing and validation. We work with you to refine your designs, creating a high-quality final product ready for mass production.
Whether you’re launching a new and improved product iteration or extending the lifecycle of your existing in-market products, our post-production capabilities help to maximise profits and keep you ahead of the competition.
Ready to experience our world-class microelectronics assembly services?
Contact us today to discuss your project's requirements, request a quote, or learn more about how we can contribute to your success.
News, articles, industry insights and more straight to your inbox.
©2025 ESCATEC. All rights reserved.