Many factors must be considered when designing an optimised and fully functioning Micro-Opto-Electronic-Mechanical-System (MOEMS) device. One of the most important factors for robust functionality is a stable production process. Our demonstrable experience spanning decades allows us to offer customers a range of development services around MOEMS technologies resulting in more compact, efficient, higher performing and cost-effective devices.
Our Chip On Board (COB) process steps consist of die bonding, wire bonding and several encapsulation techniques including glob top, dam (or underfill) and optical clear encapsulation.
The range of die bonding machines we have can work to +/- 1um, stamping or dispensing adhesives, and picking and placing bare chips from blue tape, waffle packs or gel packs.
Our wire bonding machines are suitable for all wirebond technologies including gold ball and thin wire. Quick and simple bond head changeover times of under 30 minutes can be achieved along with continuing monitoring and control of the bond process.
Our Technology Council ensure we stay ahead of the curve through continuous research and development. Our commitment to innovation enables us to leverage the latest technologies and methodologies to enhance our microelectronics assembly services.
With a global presence and strategically located facilities, we can serve clients around the world. No matter where you are, ESCATEC is ready to meet your microelectronics assembly needs.
