ESCATEC - CASE STUDY

Microelectronics Assembly Case Study | ESCATEC

Written by Neil Sharp | Jan 13, 2025 4:10:36 PM

As industries push the boundaries of miniaturisation to deliver high-performance, cost-efficient sensor solutions, precision alignment in Micro-Opto-Electro-Mechanical Systems (MOEMS) has emerged as a critical challenge.

 

The need for smaller and more energy-efficient systems demands cutting-edge manufacturing techniques and innovative design approaches.

 

In 2024 ESCATEC Switzerland AG, our MOEMS team were tasked with developing a groundbreaking solution to address this challenge.

 

Their mission was to enable the precise assembly of high-end Time-of-Flight (ToF) LiDAR sensors, a cornerstone technology in applications ranging from autonomous vehicles to medical devices, while ensuring cost-efficiency and scalability for mass production.

 

Micro-Opto-Electro-Mechanical Systems (MOEMS) combine optical, electronic, and mechanical components at microscopic scales. These systems are fundamental in advanced applications, including:

  • Automotive LiDAR systems for autonomous driving

  • Medical imaging devices for precise diagnostics

  • Telecommunication components for high-speed data transfer

ESCATEC sought to design and implement a reliable, cost-effective process for assembling MOEMS components, with a specific focus on:

  • Achieving sub-10 µm alignment precision.

  • Reducing errors and deviations caused by manufacturing tolerances.

  • Optimising assembly for scalability and cost-efficiency.